430-6003/01 – Construction of Electronical Equipments (KEZ)

Gurantor departmentDepartment of ElectronicsCredits10
Subject guarantorprof. Ing. Petr Chlebiš, CSc.Subject version guarantorprof. Ing. Petr Chlebiš, CSc.
Study levelpostgraduateRequirementChoice-compulsory
YearSemesterwinter + summer
Study languageCzech
Year of introduction2010/2011Year of cancellation
Intended for the facultiesFEIIntended for study typesDoctoral
Instruction secured by
LoginNameTuitorTeacher giving lectures
H1L20 prof. Ing. Petr Chlebiš, CSc.
Extent of instruction for forms of study
Form of studyWay of compl.Extent
Full-time Examination 28+140
Combined Examination 9+140

Subject aims expressed by acquired skills and competences

After the course are students able to explain principles of modern methods of surface mounting of electronic components on printed circuit boards, solve the problems that this sophisticated technological process brings, and apply their knowledge by putting modern technologies into practice.

Teaching methods

Individual consultations
Experimental work in labs

Summary

Subject acquaints the students with the procedure and methods for construction design electronic equipment. It acquaints with basic range of components and their construction style. It indicates different of components in commonplace industry and specially style.

Compulsory literature:

Rudolf Strauss: Surface Mount Technology. Butterworth - Heinemann, Ltd. 1994.

Recommended literature:

Technical texts at http://fei1.vsb.cz/kat430/texty/cs_cz/cz-o_kat.html

Way of continuous check of knowledge in the course of semester

Continuous checking of current project.

E-learning

Další požadavky na studenta

There are not defined other requirements for student.

Prerequisities

Subject has no prerequisities.

Co-requisities

Subject has no co-requisities.

Subject syllabus:

Electronic equipments construction requests. Passive components and their features. Semiconductor components and blocks. Correct designing of electronic circuits. Input - output circuits of electronic equipments, connecting circuits. Electronic equipment design in term of electromagnetic compatibility. Problems of electronic components placement in term of electromagnetic and thermal compatibility. Printed circuits boards (PCB). Multilayer PCB layout. Design and production of PCB, soldering technology. Power loses of the electronic components, its dimensioning and cooling. Electronic equipment cooling methods. Air and liquid cooling systems. Modern cooling systems, evaporating cooling. Safety circuits of electronic equipments. Electronic equipment design conception. Safety and diagnostics of electronic equipments. Maintenance and assembly of electronic equipments.

Conditions for subject completion

Full-time form (validity from: 2013/2014 Winter semester)
Task nameType of taskMax. number of points
(act. for subtasks)
Min. number of points
Examination Examination  
Mandatory attendence parzicipation:

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Occurrence in study plans

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Occurrence in special blocks

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