440-4105/01 – Electronic Equipment Technology (TEZ)

Gurantor departmentDepartment of TelecommunicationsCredits4
Subject guarantorIng. Karel Witas, Ph.D.Subject version guarantorIng. Karel Witas, Ph.D.
Study levelundergraduate or graduateRequirementOptional
Year1Semesterwinter
Study languageCzech
Year of introduction2010/2011Year of cancellation
Intended for the facultiesFEIIntended for study typesFollow-up Master
Instruction secured by
LoginNameTuitorTeacher giving lectures
GAJ10 Dr. Ing. Libor Gajdošík
WIT005 Ing. Karel Witas, Ph.D.
Extent of instruction for forms of study
Form of studyWay of compl.Extent
Full-time Credit and Examination 2+2
Combined Credit and Examination 2+8

Subject aims expressed by acquired skills and competences

After course finishing student will be knowing the equipment design requirements from production technology perspective. Learning outcomes are set in such way that the students are able to identify, apply and solve tasks in the field of electronic equipment technology.

Teaching methods

Lectures
Tutorials
Experimental work in labs
Project work

Summary

Computer aided design of printed circuit board. Design of wiring diagram, PCB, documentation. Printed circuit board technology, multilayer PCB, materials for PCB. Solder mask, silkscreen, special PCB. PCB component placing, component feeding. Soldering, phase diagram, lead-free solders, influence of impurities in solder, fluxes, solderability tests, wave soldering, reflow soldering, soldering in the vapor and by laser using. Solder paste, aplying paste, parameters. Metals, semimetals, nonmetals. Materials by use, semiconductors.

Compulsory literature:

GINSBERG, Gerald L. Printed circuits design: featuring computer-aided technologies. New York: McGraw Hill, 1991. ISBN 0070233098.

Recommended literature:

PRASAD, Ray. Surface mount technology. Springer 1997. ISBN 0-412-12921-3.

Way of continuous check of knowledge in the course of semester

Conditions for credit: Eagle SW complete PCB design (or other SW complete PCB design based tutor agreement). Assembled PCB has to be delivered during credit week. The PCB design documentation in form of .pdf is enclosed. The documentation comprises parts as follows: assignment, wiring diagram, PCB diagram (if double-sided, then each side separately), assembly diagram (if double-placed, then each component side separately), components list. If student has paid for the PCB and components, the assembled PCB belongs to him. If student has developed a device for the department, he is not expected to pay anything, nevertheless the assembled PCB belongs to the department.

E-learning

None.

Další požadavky na studenta

Project: Eagle SW PCB design or other SW PCB design based tutor agreement. PCB manufacturing and assembly. None.

Prerequisities

Subject has no prerequisities.

Co-requisities

Subject has no co-requisities.

Subject syllabus:

Lectures: Computer aided design of printed circuit boards (OrCAD, Pads, Protel, Eagle, KiCAD). System Eagle - wiring diagram drawing, printed circuit board design, component pinout design, finall processing. 3 lectures total. Printed circuit boards technologies. Subtract and aditive technologies. Precision classes. PCB materials. Etching solution, underetching. Fotoresists and their spreading. Drilling and its particularity. Holes metal coating. Silk-screen. Multi-layer PCB and flexible PCB manufacturing. 2 lectures total. Materials, their characteristics and aplication. Common material characteristics. Crystalography. High conductance materials, refractory materials, semimetals, nonmetals). Materials application (resistors, contacts, solders, magnets, vacuum systems). Isolants and dielectrics (plastics, glasses, ceramics). Semiconductors. Workability. Size stability. Natural and accelerated aging. Weather endurance. 3 lectures total. Thermoplastics and thermosets processing. Pressing and casting. Technological requirements on model and form. Cutting, gluing and drilling. Glues for mechanical connection. Electrical conductive glues. Cements. Metal plates processing, soldering, welding, point welding. Welding deformation and its correction. Cutting, drilling, punching. Laser cutting, water jet cutting. Screw threads in plate. Bending. Bolts using. 2 lectures total. Surface finishing and protection against corrosion: painting, protective layer electrostatic deposition, chemical and electrochemical oxidation, aluminium anodic oxidation, metal plating. Heat-up oxidation, acid and liquid alloy soulution dipping, electrolytic oxidation. Isolation lackers. Lackers for conductors, cloth, paper. Impregnation lackers. Application technologies. 1 lecture. Solders, solding and cleaning. Tin-lead solders for electronics, state diagram. Soledered joint metallography. Lead-free solders. Additives. Aging. Mechanical characteristics. Solder pastes. Screening, dispenser aplying. Reflow soldering, wave soldering, laser soldering. Fluxes, their composition. Health and ecological aspects of fluxes and solders. Removing flux residuals form PCB. Tinning (HAL). 2 lectures total. Audit trail, testing. Production waste disposal. Types of discrete components, package types, placing, joint heat stress. Surface mounted devices. 1206, 0805, MELF packages. IC packaging SOT, SOIC, PLCC, QFP, PGA, TAB... SMD devices placing. Packaging for automatic placing. Gluing before soldering. Tombstoning. Repair on finished PCB. 1 lecture. Laboratories: 8. week - Microsolder handling, paste handling, reflow in hot air, unsoldering high pin count components with hot air, ball forming from solder paste. Screening familiarization. Soldering by dipping. 9. and 10. week - Excursion (in case of interest), soldering, PCB examples, documentation creating. 11. week - Documentation (components placing diagram, list of components). Components placing and soldering. 12. week - Component placing and soldering. 13. week - Component placing and soldering. 14. week - Component placing and soldering. PCB and documentation submission. Computer laboratories: 1. week - Introduction, requirements for credit, safety in laboratory, familiarization with software for PCB design. 2. week - Project - device assignment, whose PCB will be designed, components placed and soldered. Students can choose their own device. Wiring diagram drawing in Eagle SW. 3. week - PCB design in Eagle SW. 4. week - PCB final processing, library creating. 5. week - Project PCB design in Eagle SW. 6. week - Project PCB design in Eagle SW. 7. week - Project PCB design in Eagle SW. Gerber2Bitmap and RunPlotter SW familiarization. PCB design submission for manufacturing.

Conditions for subject completion

Full-time form (validity from: 2010/2011 Winter semester)
Task nameType of taskMax. number of points
(act. for subtasks)
Min. number of points
Exercises evaluation and Examination Credit and Examination 100 (100) 51
        Exercises evaluation Credit 40  10
        Examination Examination 60  10
Mandatory attendence parzicipation:

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Occurrence in study plans

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Occurrence in special blocks

Block nameAcademic yearForm of studyStudy language YearWSType of blockBlock owner
V - ECTS - mgr. 2012/2013 Full-time Czech Optional 401 - Study Office stu. block
V - ECTS - mgr. 2011/2012 Full-time Czech Optional 401 - Study Office stu. block