454-0316/01 – Printed Circuits and Discrete Elements Assembly (MIODP)
| Gurantor department | Department of Telecommunications | Credits | 6 |
| Subject guarantor | Ing. Michal Jahelka, Ph.D. | Subject version guarantor | Ing. Michal Jahelka, Ph.D. |
| Study level | undergraduate or graduate | Requirement | Optional |
| Year | 2 | Semester | winter |
| | Study language | Czech |
| Year of introduction | 2003/2004 | Year of cancellation | 2009/2010 |
| Intended for the faculties | | Intended for study types | |
Subject aims expressed by acquired skills and competences
Understand the technology of SMD.
Learning outcomes are set so that the students are able to identify and apply tasks in the field of assembly ICs and discrete components.
Teaching methods
Summary
Bacis terms definition, package function (mechanical, electrical, thermal), package types. Package materials, chip and passive component materials, effect of thermal expansivity and mechanical stress, Chip level packaging, wire bonding, flip-chip, TAB, COB, DCA, packages direct on PCB. Multi-chip modules packaging, MCM technology, hybrid modules, Discrete components packaging, through hole devices, SMT technology. Electromechanical components, push buttons, switches, trimmers, potenciometers, used materials, processing, parameters. Membrane and rubber keyboards. Electronic switches - optical, hall effect, capacitive. Potenciometer replacements. Passive components (materials, parameters, processing). Resistors - carbon composition, carbon film, metal film, foil, cermet, wire wound, trimming, construction, packages, marking. Inductors - core types, materials, package, winding types, processing. Ceramic capacitors - dielectrics, construction, processsing. Film capacitors. Tantalum capacitors - parameters, function. materials, processing. Electrolytic capacitors. Supercapacitors. Displays - LCD (TN, STN, DSTN, CSTN, IPS, MVA, Colesteric, TFT), EL, Plasma, OLED, PLED - parameters, function principles, types, processing, optical parameters, technology. Backlight of LCD (LED, EL,CCFL, EEFL). Components attaching on PCB, soldering, gluing with electrical conductive paste, placing, component feeding. Physical impacts on reliability, diagnostic methods. Mounting components under mechanical or temperature stress, connecting to heat sink, connector mounting.
Compulsory literature:
Mach P., Skočil V., Urbánek J., Montáž v elektronice - Pouzdření aktivních součástek, plošné spoje. ČVUT, Praha 2001
Abel M., SMT - Technologie povrchové montáže, Platan 2000
Szendiuch I., Mikroelektronické montážní technologie, VUTIUM, VUT Brno 1997
Recommended literature:
Šavel J., Materiály a technologie v elektronice a elektrotechnice, BEN 1999
Way of continuous check of knowledge in the course of semester
Semstral project
E-learning
Other requirements
Prerequisities
Subject has no prerequisities.
Co-requisities
Subject has no co-requisities.
Subject syllabus:
Bacis terms definition, package function (mechanical, electrical, thermal), package types. Package materials, chip and passive component materials, effect of thermal expansivity and mechanical stress, Chip level packaging, wire bonding, flip-chip, TAB, COB, DCA, packages direct on PCB. Multi-chip modules packaging, MCM technology, hybrid modules, Discrete components packaging, through hole devices, SMT technology. Printed circuit boards, materials and characteristics of PCB, PCBs for surface mounting technology, solder mask, surface preservatives. Components attaching on PCB, soldering, gluing with electrical conductive paste, placing, component feeding. Physical impacts on reliability, diagnostic methods. Mounting components under mechanical or temperature stress, connecting to heat sink, connector mounting.
Conditions for subject completion
Occurrence in study plans
Occurrence in special blocks
Assessment of instruction
Předmět neobsahuje žádné hodnocení.