454-0517/02 – Electronic Equipment Technology (TEZ)

Gurantor departmentDepartment of TelecommunicationsCredits6
Subject guarantorIng. Michal Jahelka, Ph.D.Subject version guarantorIng. Michal Jahelka, Ph.D.
Study levelundergraduate or graduateRequirementChoice-compulsory
Year3Semesterwinter
Study languageCzech
Year of introduction2004/2005Year of cancellation2009/2010
Intended for the facultiesFEIIntended for study typesBachelor
Instruction secured by
LoginNameTuitorTeacher giving lectures
JAH01 Ing. Michal Jahelka, Ph.D.
Extent of instruction for forms of study
Form of studyWay of compl.Extent
Full-time Credit and Examination 2+2
Combined Credit and Examination 2+2

Subject aims expressed by acquired skills and competences

Understand the construction of facilities in terms of production technology. Learning outcomes are set so that the students are able to identify and apply tasks in the field of electronic equipment.

Teaching methods

Summary

Materials for accurate mechanics and weak-current electrotechnics. Isulative varnish. Electro-conductive adhesive. Procedure at circuit construction on printed circuits. surface connection production technology. printed circuit design computer support technology and of its production. Solder, soldering and cleaning. soldered joint Metallography. Flux. Soldering flux. Component and its assembly on board. Component for surface assembly. SMD parts assembly. Qualifying test. hybrid circuit technology.

Compulsory literature:

Abel, M. : Terchnologie povrchové montáže, Platan 2000 Mach, P., Skočil V., Urbánek J.: Montáž v elektronice, ČVUT Praha, 2001 Záhlava V.: OrCAD 10, Grada 2004 Abel, M. : Plošné spoje se SMD, návrh a konstrukce, Platan 2000.

Recommended literature:

Šavel, J. : Materiály a technologie v elektronice a elektrotechnice, BEN 1999. Strauss, R.: Surface mount technology, Butterworth - Heinemann, 1994 Szendiuch, I.: Mikroelektronické montážní technologie, VUTIUM Brno, 1997 Musil, V. a kol.: Konstrukce a technologie elektronických zařízení, PC DIR Brno, 1994

Way of continuous check of knowledge in the course of semester

Conditions for credit: PCB must be designed in program OrCAD. This must be delivered at latest at credit week, including schematic. Next bust be elaborated documentation in programs: Ms Word, OpenOffice or PDF format. In documentation must be: schematic, PCB, assembly, dril drawing. Finished PCB with seldered components must be shown. It must contain at least 50% SMD devices. PCB must be reasonably complicated (at least 50 components). Student can either pay his PCB and components and this can keep or student develop devices for department and needn't pay anything, but must keep given technology and device cannot keep.

E-learning

Další požadavky na studenta

Prerequisities

Subject has no prerequisities.

Co-requisities

Subject has no co-requisities.

Subject syllabus:

Lectures: Computer aided design of printed circuit boards (OrCAD, Pads, Eagle, kiCAD). System OrCAD - schematic drawing, printed circuit board design, component design, finall process (3 lectures). Printed circuit boards technology. Subtract and aditive technology. Classes. Materials for PCB. Etchants, underetching. Fotoresists, spreading. Dry resists. Subtractive technology process. Tinning (HAL). Aditive technology process. Drilling and its specify. Bores metal coating. Silk-screen. Multi-layer and flexible PCB manufacturing. Materials, characteristics and aplication. Common material characteristics: internal stress, aging natural and accelerated, weather endurance, workability, stability of size. Artifical materials: Thermoplastics (acrylic glass, polyvinylchloride,polyethylene, polypropylene, polyisobutylene,polyacrylate, polyamid, polyester, polycarbonate). Thermosets (bakelite, polyester, epoxy resin, polyuretan). Thermoplastics and thermosets process. Pressing and casting. Technological requirements on model and form. Cutting, gluing and drilling. Bolts using. Isolation lackers. Lackers for conductors, fabric, paper. Impregnation lackers. Application technology. Glues form mechanical connection. Electrical conductive glues as a conductor. Cements. Surface finishing and protection against corrosion: painting, protective layer electrostatic deposition, oxidizing, aluminium anodic oxidation, metal plating. Heat-up oxidation, salt soulution and acid dipping, electrolytic oxidation. Solders, solding and cleaning. Tin-lead solders. State diagram tin-lead. Soledered joint metallography. Lead-free solders. Adulterants. Aging. Contamination effects. Cooling and its effect on crystalic structure. Mechanical characteristics. Solder pastes. Screening, dispens aplying. Reflow soldering, wave soldering, impulse and laser soldering. Fluxes, its composition. Healt and ecological aspects on fluxes and solders. Removing flux residuals form PCB. Mounting with cleaning aspect. Audit trail, testing. PCB waste disposal. Types of discrete components, packege types, placing, connection heat stress. Surface mounted devices: Resistors and capacitors, sizes, types. Diodes. IC packaging - SOT, SOIC, PLCC, QFP, PGA, TAB... SMD device placing. Packaging for automatic placing. Gluing before soldering. Tombstoning. Glued joints. Metal plates processing: soldering, welding, point welding. Welding deformation and its correction. Cutting, drilling, punching. Laser cutting, water jet cutting. Screw threads in plate. Bending. Repair on finished PCB, demounting, surface preparation, placing new component. Construnction aspects on device repairs. Crystalography, materials structure, dislocations, limiting of dislocation movement, material hardness. Materials in electronic (high conductance, other metals, refractory, semimetals, nonmetals). Materials according with usage (resistors, contacts, solders, magnetics). Isolants and dielectrics (plastics, glases, ceramics). Semiconductors. Liquid crystals. Laboratories: 8. week - Microsolder handling, paste handling, reflow in hot air, unsoldering many pin count components with hot air, ball forming with solder paste. Familiar with screening. Soldering with dipping. 9 and 10 week - possible excursion, soldering, demonstrations of PCB, creating documentation. 11. week - Documentation. Component placing. 12. week - Component placing and soldering 13. week - Component placing and soldering 14. week - Component placing and soldering. PCB show, documentation delivery, credit. Projects: Design PCB in program OrCAD Producing and placing designed PCB Computer labs: 1. week - introduction, familiarization with requirements for credit, safety in laboratory, familiarization with programs for PCB design. 2. week - device schematic accept, students can choose their own device, but it must be reasonable complicated. Drawing schematic in program OrCAD. 3. week - DPS design in OrCAD program. 4. week - final processing, library creating. 5. week - Work with OrCAD on own device. 6. week - Work with OrCAD on own device. 7. week - Work with OrCAD on own device. Programs Gerber2Bitmap and RunPlotter. Deliver designed PCB in OrCAD program for production.

Conditions for subject completion

Full-time form (validity from: 2004/2005 Summer semester)
Task nameType of taskMax. number of points
(act. for subtasks)
Min. number of points
Exercises evaluation and Examination Credit and Examination 100 (100) 51
        Exercises evaluation Credit 40 (40) 15
                Packages definitions, layout, using SMD, pads Laboratory work 10  0
                Wire width, vias, cooper pour, thermal reliefs, mounting holes Laboratory work 10  0
                General board look, soldering quality, cleaning necessity, technology Laboratory work 5  0
                Final documentation Project 15  0
        Examination Examination 60 (60) 0
                Oral examination with preparation Oral examination 60  0
Mandatory attendence parzicipation:

Show history

Occurrence in study plans

Academic yearProgrammeField of studySpec.FormStudy language Tut. centreYearWSType of duty
2009/2010 (B2645) Electrical Engineering, Communication and Computer Systems (2612R018) Electronics and Communication Technology P Czech Ostrava 3 Choice-compulsory study plan
2009/2010 (B2645) Electrical Engineering, Communication and Computer Systems (2612R018) Electronics and Communication Technology K Czech Ostrava 3 Choice-compulsory study plan
2008/2009 (B2645) Electrical Engineering, Communication and Computer Systems (2612R018) Electronics and Communication Technology P Czech Ostrava 3 Choice-compulsory study plan
2008/2009 (B2645) Electrical Engineering, Communication and Computer Systems (2612R018) Electronics and Communication Technology K Czech Ostrava 3 Choice-compulsory study plan
2007/2008 (B2645) Electrical Engineering, Communication and Computer Systems (2612R018) Electronics and Communication Technology P Czech Ostrava 3 Choice-compulsory study plan
2007/2008 (B2645) Electrical Engineering, Communication and Computer Systems (2612R018) Electronics and Communication Technology K Czech Ostrava 3 Choice-compulsory study plan
2006/2007 (B2645) Electrical Engineering, Communication and Computer Systems (2612R018) Electronics and Communication Technology P Czech Ostrava 3 Choice-compulsory study plan
2006/2007 (B2645) Electrical Engineering, Communication and Computer Systems (2612R018) Electronics and Communication Technology K Czech Ostrava 3 Choice-compulsory study plan
2005/2006 (B2645) Electrical Engineering, Communication and Computer Systems (2612R018) Electronics and Communication Technology P Czech Ostrava 3 Choice-compulsory study plan
2005/2006 (B2645) Electrical Engineering, Communication and Computer Systems (2612R018) Electronics and Communication Technology K Czech Ostrava 3 Choice-compulsory study plan
2004/2005 (B2645) Electrical Engineering, Communication and Computer Systems (2612R018) Electronics and Communication Technology P Czech Ostrava 3 Choice-compulsory study plan
2004/2005 (B2645) Electrical Engineering, Communication and Computer Systems (2612R018) Electronics and Communication Technology K Czech Ostrava 3 Choice-compulsory study plan

Occurrence in special blocks

Block nameAcademic yearForm of studyStudy language YearWSType of blockBlock owner