455-0901/01 – Manufacturing of Microelectronic Devices (VMP)
| Gurantor department | Department of Measurement and Control | Credits | 0 |
| Subject guarantor | doc. Ing. Milan Hutyra, CSc. | Subject version guarantor | doc. Ing. Milan Hutyra, CSc. |
| Study level | postgraduate | Requirement | Choice-compulsory |
| Year | | Semester | winter + summer |
| | Study language | Czech |
| Year of introduction | 1995/1996 | Year of cancellation | 2009/2010 |
| Intended for the faculties | FEI | Intended for study types | Doctoral |
Subject aims expressed by acquired skills and competences
To acquire the students about the basics of solid state technology used in manufacturing of microelectronic devices (ICs and microelectronic sensors)
Teaching methods
Summary
The subject is dedicated to the area:
materials for microelectronic devices manufacturing
basics of solid state technoloy
diagnostic method used in IC´s manufacturing
the structure of bipolar and unipolar IC
Compulsory literature:
VLSI Technology-edited by S.M.Sze,McGraw-Hill Book Comp.1983
A.S.Grove :Physics and Technology of Semiconductor Devices, John Wiley and Sons Inc. 1967
Recommended literature:
S.Wolf, R.N.Tauber : Silicon Processing for VLSI ERA -Process technology, , Lattice Press 1990
Bipolar technology, CD training material of TESLA SEZAM
Fromsilica to silicon, CD training material of TESLA SEZAM
Way of continuous check of knowledge in the course of semester
E-learning
Other requirements
Prerequisities
Subject has no prerequisities.
Co-requisities
Subject has no co-requisities.
Subject syllabus:
Lectures:
Materials used for manufacturing of microelectronic devices, clean room. Silicon single/crystal grouth and wafering.
Basics of solid state technology. Physical and chemical methods for preparation of thin film layers .Epitaxial growth.
Introduction of dopants into silicon. Thermal diffusion and ion implantation.
Method for processing of layers. Lithography. Chemical etching. Dry etching.
Assembly of microelectronic devices. Testing and reliability programs. Diagnostic methods in semiconductor device manufacturing.
Technology of bipolar and unipolar ICs. Planar technology. Isoplanar, I2L, CMOS, BiCMOS.
Microtechnology as the technology for microelectronic sensor manufacturing. Micromaschining.
Conditions for subject completion
Occurrence in study plans
Occurrence in special blocks
Assessment of instruction
Předmět neobsahuje žádné hodnocení.